PCB Capability
| Item | 2021 | 2022 |
| Layer | 20 | 24 |
| Maximum board size | 1092mm*660mm | |
| Maximum board thickness | 10mm | |
| Minimum board thickness | 0.30mm | 0.25mm |
| Thickness of the small core board (excluding copper) | 0.05mm | |
| Maximum (finished) copper thickness | inner layer:12OZ outer layer:12OZ | |
| Minimum width/space | 0.06/0.06mm | |
| Minimum mechanical drilling pore diameter | 0.25mm | 0.15mm |
| Minimum distance between two hole-sides (different network) | 0.23mm | |
| Aspect ratio | 15:01 | |
| Impedance control tolerance | ±8% | ±6% |
| High thermal conductive plate | volume production | volume production |
| Heat dissipation substrate | ||
| Embedded planar capacitance/impedance board | ||
| HF high-speed board | small lot production | |
| Step position partial bonding (including bonding finger) | ||
| Secondary step board | ||
| Embedded magnetic core board | ||
| Four-layer PTFE board | ||
| Surface treatment | immersion gold, bonding, solder coating with/without lead, OSP, immersion tin, ENEPIG, immersion silver, copper-tin plating, electrolytic soft gold, electrolytic platinum | |
HDI Capability
| Item | 2021 | 2022 |
| Line Width / Line Spacing | 0.05/0.05mm | 0.045/0.05mm |
| Max Layer | 30 | 36 |
| Min. Production Broad Thickness | 0.35mm | 0.30mm |
| Thinnest Substrate Thickness | 0.05mm | |
| Thinnest Dielectric Layer Thickness | 0.05mm | |
| Min Buried Hole /Pad Size | 0.075/0.225mm | |
| Max Buried Hole / Pad Size | 0.2/0.4mm | |
| Max Buried Hole Aspect Ratio | 1:01 | |
| HDI Feature | 3+N+3 | 4+N+4 |